open access publication

Article, 2024

The evolution of intergranular networks during grain growth and its effect on percolation behavior

Acta Materialia, ISSN 1359-6454, Volume 274, 10.1016/j.actamat.2024.119987

Contributors

Shahani A.J. (Corresponding author) [1] Walter K. [1] Zhang J. 0000-0003-4982-1830 Ludwig W. 0000-0002-3256-3831 [2] [3] Jensen D.J. [4] Zhang Y. 0000-0002-6901-0309 [4]

Affiliations

  1. [1] University of Michigan
  2. [NORA names: United States; America, North; OECD];
  3. [2] European Synchrotron Radiation Facility
  4. [NORA names: France; Europe, EU; OECD];
  5. [3] INSA-Lyon
  6. [NORA names: France; Europe, EU; OECD];
  7. [4] Technical University of Denmark
  8. [NORA names: DTU Technical University of Denmark; University; Denmark; Europe, EU; Nordic; OECD]

Abstract

Triple junctions (TJs) are line defects in three-dimensional (3D) polycrystalline materials where three grains meet. Transport along the TJs depends on the connectivity between them. Here, we investigate the connectivity of more than 6000 TJs in a 3D microstructure of pure iron (Fe) through the lens of bond percolation. Our efforts are made possible by synchrotron-based x-ray diffraction tomography, which allows us to resolve the TJ network both temporally and spatially, during grain growth. In the framework of standard percolation theory, we determine a percolation threshold of the TJs, above which there exists a continuous pathway of TJs that travels infinitely far. Our experimental results indicate a surprisingly different percolation threshold (by 16%) compared to models and theories. The reason for the discrepancy is that the real TJ network has a topological disorder that is not present in the idealized microstructures considered in prevailing models and theories. Leveraging the wealth of time-resolved data we trace the origin of this disorder by following the topological transitions that accompany grain growth. Overall, the insights obtained in this study can help guide the design of polycrystalline materials via defect engineering.

Keywords

Percolation threshold, Temporal evolution, Three-dimensional microstructure, Triple junctions, X-ray synchrotron radiation

Funders

  • Otto Mønsteds Fond
  • Army Research Office
  • Danmarks Tekniske Universitet

Data Provider: Elsevier